Rugged highly reliable embedded computing solutions
Embedded Computing Solutions for Communications Industry Applications
WINSYSTEMS’ November Newsletter focuses on the Communications Industry market. Our embedded computing solutions are engineered to meet the diverse requirements found in a broad range of applications across the Communications industry. OEMs serving this market look to our products for: • Rugged industrial hardware designed for harsh environments • Wide operating temperature range: -40ºC to… Read More »
Read More >Embedded Computing Solutions for Energy Management Applications
WINSYSTEMS’ latest eNewsletter highlights embedded computing technologies designed to reliably enable energy management and control systems for renewable energy storage applications including hybrid energy systems involving solar, wind, and battery storage technologies. Our rugged embedded industrial computers, SBCs, and panel PCs ably support real-time monitoring, control, and optimization capabilities for macro-grid, micro-grid, and off-grid energy… Read More »
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Rugged fan-less industrial computers built to deliver highly reliable performance in harsh environments WINSYSTEMS has expanded its product line of rugged industrial fan-less enclosed computer systems with the addition of two new enclosed fan-less systems. These new systems are designed to fully enable industrial applications requiring fan-less low-power edge computing solutions in space-constrained installations. WINSYSTEMS’ SYS-ITX-N-6425E is… Read More »
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U.S.-manufactured COMeT6-1100 adds to company’s fully supported COM Express solutions; harnesses higher computational performance with long-term reliability and availability GRAND PRAIRIE, Texas – August 24, 2023 – American embedded computing leader WINSYSTEMS today debuted the latest entry in its well-received computer-on-module product line: the COMeT6-1100 COM Express® Type 6 Compact CPU module. Leveraging the 11th… Read More »
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Prototyping ensures that all stakeholders in a product’s success have a clear picture of the (nearly) finished product. It allows software testing to occur on real hardware. And it lets the design team focus on the user interface. Implementing these steps concurrently results in a faster time to market and fewer design changes along the… Read More »
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If you’re a regular reader of this blog, you know that we have covered many board specifications, form factors, standards, and so on. For the general embedded computing market, we’ve covered just about all the mainstream standards. The tip of the iceberg reveals such standards as EPX, EPIC, 3.5-in., PC104, and multiple variations of ITX…. Read More »
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