The ATX-M-CC462-T6 is a fully featured COM Express Type 6 evaluation carrier board designed for use with the WINSYSTEMS Intel® Tiger Lake UP3 COM Express and other COM Express Type 6 modules.

The carrier implements the full capabilities of the Type 6 connectors extant on the WINSYSTEMS COMeT6-1100 COM Module and is compliant with PICMG® COM.0 Rev 3.0 Specifications.

The ATX-M-CC462-T6 is a standard, MicroATX form factor COM Express Type 6 carrier board that is compatible with the WINSYSTEMS COMeT6-1100 COM Express Type 6 Intel Tiger Lake UP3 design or other compliant COM Express Type 6 boards.


SKU: ATX-M-CC462-T6 Categories: ,
Form Factor

MicroATX 9.6 x 9.6 inches (244 x 244mm)


4x SATA Type III (6Gb/s) channels


Support for Dual Channel LVDS and eDP including backlight

Networking Interface

1x 2.5G Ethernet

Onboard I/O

4 x USB 3.2 Gen1 (2x Front Panel Type A, 2x Header)

4 x USB 2.0 (2x Front Panel, 2x Header)

2 x RS 232 2pin (Tx/Rx) from COMe Module

2 x RS232/422/485 Multiprotocol Legacy mode

1 x USB client port

1 x PCIe x16 slot

2 x PCIe x4 slot

1 x VGA port (COM option)

1 x LVDS connector (COM option)

1 x eDP connector (COM option)

1 x EEPROM socket

4 x SATA connectors

1 x SPI flash socket

1 x LPC header

1 x Dual Channel COM headers (COM Console)

1 x Dual channel RS232/422/48 Serial Port

1 x Fan Header

1 x GPIO/Feature connector

Back Panel Connectors

1 x 2.5 Ethernet RJ45 port

1 x Audio with separate 3.5mm jacks for MIC, LINE-OUT, LINE-IN

3 x Standard DisplayPort connectors

2 x USB 3.1 Type A connector

2 x USB 2.0 Type A connector


ATX Mode: Standard ATX Power input

AT Mode: 12VDC +/- 5%


Operating Temperature
-40ºC to +85ºC with supporting cooling options

Storage Temperature
-40ºC to +85ºC

Thermal Shock
Operational Temperature limit exposures in <1 minute

Shock IAW IEC60068-2-27
Half Sine Wave, 50g/11ms

Vibration IAW IEC60068-2-27
Random waveform, 10Hz-2KHz, 7g

CE Compliant

CISPR A and FCC Class A

ESD (Human body) – JEDC Standard JA114/JS-001

CE Compliant

ESD (Human body) – JEDEC Standard JA114/JS-001


Dimensions: 6.7 in x 6.7 in (mITX) (170 mm x 170 mm)

Weight: 8.0 oz (225 gm) without COMe Module

PC Board thickness: 0.078 inches (2.0 mm)


Windows 10 and 11