COMeT6-1100 COM Express® Type 6 Compact Module with 11th Gen. Intel® Core™ Processor

Description

The COMeT6-1100 is an industrial COM Express Type 6 Compact module with an Intel® 11th Gen Core™ i3/i5/i7 Processor. This industrial module is designed and manufactured in the USA. The small form factor processor mezzanine can be plugged onto a carrier board that contains user-specific I/O requirements to provide intelligent design for long-life industrial automation, energy and storage, industrial building equipment, transportation and logistics and similar rugged applications.

Features

Made In USA Badge
Extended Temperature
ROHS Compliant
Lifetime Support
Quality Certified
Features
Processor Options

Intel® Core™ i7-1185GRE

Intel® Core™ i5-1145GRE

Intel. Core™ i3-1115GRE

Intel® Core™ i7-1185G7E*

Intel® Core™ i5-1145G7E*

Intel® Core™ i3-1115G4E*

Intel® Celeron® 6305E*

* Special Order

BIOS

AMI UEFI in Quad-SPI Flash with Intel. AMT support

Memory

Up to 32GB LPDDR4 4266 MT/s (2133MHz) System Memory

Commercial and Industrial memory options available (see ENVIRONMENTAL specifications)

Storage

2x SATA III (6 Gb/s)

Display

Four independent video outputs

− 3x Digital Display Interface (DDI) to DisplayPort++ / HDMI / DVI

− 1x eDP (optional LVDS)

− 1x VGA

Expansion

PCIe Gen4 x4 for PEG or NVMe

5x PCIe lanes configurable to (4×1 (Default), 2×1 + 1×2, or 1×4) and Lane 4 (x1 only)

4x USB 3.2 Gen 1, 8x USB 2.0

1x i226 2.5 Gb/s Ethernet RGMII

Intel HD Audio

2x UART with console redirection

4x GPI, 4x GPO (SDIO option for MicroSD socket)

Power

Standard 12V Input, +/- 10%. CPU TDP = 28W max, software controllable to reduce to 15W or 12W TDP

Software

Broad OS Support, including Windows10, Windows 11, Ubuntu, Red Hat, and other x86 operating systems

Custom configurable UEFI-based AMI BIOS

System Management Libraries and Tools

Environmental

Commercial Temperature: 0ºC to +60ºC (32ºF to +140ºF)1

Industrial Temperature: -40ºC to +85ºC (-40ºF to +185ºF)1

CE Compliant

1 Requires thermal solution via heat spreader/heatsink and/or airflow

Mechanical

Dimensions – 3.75 in x 3.75 in (95 mm x 95 mm)

• Weight – 2.75 oz (78 g)

• PC Board thickness 0.078 inches (2 mm)

Note: Above dimension data does not include the height of thermal solution options. Contact sales@winsystems.com for more technical information.

Thermal Solutions

Heat Spreader Options:

• COMeT6-460-SPRD-0 Spreader through-hole

• COMeT6-460-SPRD-1 Spreader threaded

 

Heat Sink Options:

• COMeT6-460-HTSK-0 Heat sink through-hole, no fan

• COMeT6-460-HTSK-1 Heat sink threaded, no fan

• COMeT6-460-HTSKF-0 Heat sink through-hole with fan

• COMeT6-460-HTSKF-1 Heat sink threaded with fan