COMeT6-1100 COM Express® Type 6 Compact Module with 11th Gen. Intel® Core™ Processor

Description

The COMeT6-1100 is an industrial COM Express Type 6 Compact module with an Intel® 11th Gen Core™ i3/i5/i7 Processor. This industrial module is designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier board that contains user-specific I/O requirements.

Features

Made In USA Badge
Extended Temperature
ROHS Compliant
Lifetime Support
Quality Certified
Features
Processor Options

Intel® Core™ i7-1185GRE

Intel® Core™ i5-1145GRE

Intel. Core™ i3-1115GRE

Intel® Core™ i7-1185G7E*

Intel® Core™ i5-1145G7E*

Intel® Core™ i3-1115G4E*

Intel® Celeron® 6305E*

* Special Order

BIOS

AMI UEFI in Quad-SPI Flash with Intel. AMT support

Memory

Up to 32GB LPDDR4 4266 MT/s (2133MHz) System Memory

Commercial and Industrial memory options available (see ENVIRONMENTAL specifications)

Storage

2x SATA III (6 Gb/s)

Display

Four independent video outputs

− 3x Digital Display Interface (DDI) to DisplayPort++ / HDMI / DVI

− 1x eDP (optional LVDS)

− 1x VGA

Expansion

PCIe Gen4 x4 for PEG or NVMe

5x PCIe lanes configurable to (4×1 (Default), 2×1 + 1×2, or 1×4) and Lane 4 (x1 only)

4x USB 3.2 Gen 1, 8x USB 2.0

1x i226 2.5 Gb/s Ethernet RGMII

Intel HD Audio

2x UART with console redirection

4x GPI, 4x GPO (SDIO option for MicroSD socket)

Power

Standard 12V Input, +/- 10%. CPU TDP = 28W max, software controllable to reduce to 15W or 12W TDP

Software

Broad OS Support, including Windows10, Windows 11, Ubuntu, Red Hat, and other x86 operating systems

Custom configurable UEFI-based AMI BIOS

System Management Libraries and Tools

Environmental

Commercial Temperature: 0ºC to +60ºC (32ºF to +140ºF)1

Industrial Temperature: -40ºC to +85ºC (-40ºF to +185ºF)1

CE Compliant

1 Requires thermal solution via heat spreader/heatsink and/or airflow

Mechanical

Dimensions – 3.75 in x 3.75 in (95 mm x 95 mm)

• Weight – 2.75 oz (78 g)

• PC Board thickness 0.078 inches (2 mm)

Note: Above dimension data does not include the height of thermal solution options. Contact sales@winsystems.com for more technical information.

Thermal Solutions

Heat Spreader Options:

• COMeT6-460-SPRD-0 Spreader through-hole

• COMeT6-460-SPRD-1 Spreader threaded

 

Heat Sink Options:

• COMeT6-460-HTSK-0 Heat sink through-hole, no fan

• COMeT6-460-HTSK-1 Heat sink threaded, no fan

• COMeT6-460-HTSKF-0 Heat sink through-hole with fan

• COMeT6-460-HTSKF-1 Heat sink threaded with fan