Features | |
---|---|
PROCESSOR OPTIONS | Intel® Xeon® W-11865MRE |
OPERATING SYSTEM | Linux Ubuntu, Windows 10/11 IoT, and other x86 real-time OS |
SOFTWARE | Custom configurable UEFI-based AMI BIOS |
SECURITY | On-board discrete TPM 2.0 hardware security |
MEMORY | Up to 96GB DDR4 SODIMM |
STORAGE | 2x mini PCIe slots that can be used for mSATA |
DISPLAY | 4K UltraHD |
AUDIO | HD Audio (Cirrus Logic CS4207 codec) |
NETWORK | Port 0, Intel I226IT, 2.5Gb Ethernet |
EXPANSION | Mini PCIe Expansion: 2x full-length cards (Both sockets have PCIe, USB, and SATA signaling for mSATA operation) |
I/O | 8-bit GPIO |
POWER | Input: Single +12V input +/- 5% (5mm pitch terminal connector) |
THERMAL OPTIONS | SBC-477-TS570-R-2: With Heatsink |
MECHANICAL | Dimensions: – SBC-477-TS570-R-2 with Heatsink: 125mm x 95mm x 53mm – SBC-477-TS570-R-3 with Heatsink and Fan: 125mm x 97mm x 53mm Weight: 590g / 20.81oz |
ENVIRONMENTAL | Industrial Temperature: -40°C to +70°C (-40ºF to +185°F) with model -3 thermal solution1 Humidity: 5% to 95% non-condensing CE Compliant RoHS Compliant 1 The COM and carrier are capable to +85°C with an adequate thermal solution. |
ORDER INFORMATION | SBC-477-TS570-R-2: With Heatsink |
Accessories | Cable Set: CBL-SET-477-CNT-1 |
SBC-477-TS570 Rugged SBC with Intel® Xeon® W-11865MRE COM Express Type 6 Module on Carrier and USB 3.0
The SBC-477-TS570 is a rugged small form factor embedded computer designed for high-performance applications. It features an Intel® Xeon® W-11865MRE processor for energy-efficient processing for demanding applications. The COM Express Type 6 Module mounted on a COM Express Type 6 Basic carrier provides Mini PCIe expansion and 4 x USB 3.0 and 2x USB 2.0 connectivity. Engineered for extreme conditions, it operates reliably within an extended temperature range of -40°C to +70°C with an appropriate thermal solution.
This embedded SBC-477-TS570 system includes on-board discrete TPM 2.0 hardware security, supports multiple display configurations, and offers versatile expansion options. It is compatible with Linux, Windows 10 IoT, Windows 11 IoT, and other x86 real-time operating systems.
DATA SHEET PRODUCT INFO-40°C to +70°C
ROHS COMPLIANT
Features
- Compact form factor for space-constrained applications
- Intel Xeon W-11865MRE
- -40°C to +70°C extended temperature range with thermal solution
- Extended product life cycle of 10+ years
- High MTBF
- Ruggedized locking pin header connectors
- Mini PCIe expansion
- 4x USB 3.0 and 4x USB 2.0
- SBC-472-TS570 Datasheet (PDF)
Datasheets
- SBC-477-TS570 Product Manual (PDF)
Product Manuals
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