Features | |
---|---|
PROCESSOR OPTIONS | Intel® Xeon® W-11865MRE |
OPERATING SYSTEM | Linux, Windows 10/11 IoT |
SOFTWARE | Custom configurable UEFI-based AMI BIOS |
SECURITY | On-board discrete TPM 2.0 hardware security |
MEMORY | 128GB DDR4-3200 |
STORAGE | 4x SATA ports: 2x mSATA and 2x mSATA with External Vertical Locking Connectors |
DISPLAY | 4K UltraHD 1x LVDS interface (single ch 24-bit, dual ch 48-bit) |
AUDIO | HD Audio (Cirrus Logic CS4207 codec) |
NETWORK | 2x Gigabit Ethernet (10/10/1000) Ports |
EXPANSION | Mini PCIe Expansion: |
I/O | 8-bit GPIO |
EXTERNAL INTERFACES | SMBus, I2C, Battery Low Indication, PC speaker Interface, System Status (S3 and Reset Outputs) |
POWER | Input: Single +12V input +/- 5% (5mm pitch terminal connector) |
THERMAL OPTIONS | SBC-477-TS570-2: With Heatsink |
MECHANICAL | Dimensions: – SBC-477-TS570-2 with Heatsink: 125mm x 95mm x 53mm – SBC-477-TS570-3 with Heatsink and Fan: 125mm x 97mm x 53mm Weight: 590g / 20.81oz |
ENVIRONMENTAL | Industrial Temperature (w/ -3 Heatsink + Fan): -40°C to +85°C (-40ºF to +185°F)1 Humidity: 5% to 95% non-condensing CE Compliant RoHS Compliant 1 Requires thermal solution via heatsink and airflow |
ORDER INFORMATION | SBC-477-TS570-2: With Heatsink |
Accessories | Cable Set: CBL-SET-477-CNT-1 |
SBC-477-TS570 Rugged Compact Carrier with Intel® Xeon® W-11865MRE COM Express Type 6 Module, MiniPCIe expansion and USB 3.0
Description
The SBC-477-TS570 is a rugged small form factor embedded computer designed for high-performance applications. It features an Intel® Xeon® W-11865MRE COM Express Type 6 Module mounted on a compact carrier, providing MiniPCIe expansion and 4 x USB 3.0 and 2x USB 2.0 connectivity. Engineered for extreme conditions, it operates reliably within an extended temperature range of -40°C to +85°C with an appropriate thermal solution.
This embedded SBC-477-TS570 system includes on-board discrete TPM 2.0 hardware security, supports multiple display configurations, and offers versatile expansion options. It is compatible with Linux, Windows 10 IoT, Windows 11 IoT, and other x86 real-time operating systems.
Features
- Compact form factor for space-constrained applications
- Intel® Xeon® W-11865MRE
- -40°C to +85°C extended temperature range with thermal solution
- Extended product life cycle of 15+ years
- High MTBF
- Ruggedized locking pin header connectors
- Mini PCIe expansion
- 4x USB 3.0 and 2x USB 2.0
"*" indicates required fields
SKU: SBC-477-TS570
Categories: Computer on Module, Single Board Computers (SBC)
Tags: -40°C to +85°C, COM Express Type 6, embedded computers, extended temp, high MTBF, industrial SBC, Intel® Xeon®, Mini PCIe expansion, USB 3.0
- SBC-472-TS570 Datasheet (PDF)
Datasheets