SBC-477-TS570 Rugged SBC with Intel® Xeon® W-11865MRE COM Express Type 6 Module on Carrier and USB 3.0

The SBC-477-TS570 is a rugged small form factor embedded computer designed for high-performance applications. It features an Intel® Xeon® W-11865MRE processor for energy-efficient processing for demanding applications. The COM Express Type 6 Module mounted on a COM Express Type 6 Basic carrier provides Mini PCIe expansion and 4 x USB 3.0 and 2x USB 2.0 connectivity. Engineered for extreme conditions, it operates reliably within an extended temperature range of -40°C to +70°C with an appropriate thermal solution.

This embedded SBC-477-TS570 system includes on-board discrete TPM 2.0 hardware security, supports multiple display configurations, and offers versatile expansion options. It is compatible with Linux, Windows 10 IoT, Windows 11 IoT, and other x86 real-time operating systems.

DATA SHEET PRODUCT INFO

-40°C to +70°C

ROHS COMPLIANT

Features

  • Compact form factor for space-constrained applications
  • Intel Xeon W-11865MRE
  • -40°C to +70°C extended temperature range with thermal solution
  • Extended product life cycle of 10+ years
  • High MTBF
  • Ruggedized locking pin header connectors
  • Mini PCIe expansion
  • 4x USB 3.0 and 4x USB 2.0
Features
PROCESSOR OPTIONS

Intel® Xeon® W-11865MRE
8 Cores, 16 Threads (4.7 GHz)
Cache: 1.5 MB L2
Power: 45W typical

OPERATING SYSTEM

Linux Ubuntu, Windows 10/11 IoT, and other x86 real-time OS

SOFTWARE

Custom configurable UEFI-based AMI BIOS
System Management Libraries and Tools

SECURITY

On-board discrete TPM 2.0 hardware security
vPro® Security Platform

MEMORY

Up to 96GB DDR4 SODIMM

STORAGE

2x mini PCIe slots that can be used for mSATA
2x SATA ports with External Vertical Locking Connector

DISPLAY

4K UltraHD
2x DisplayPort++ (DDI) interface which can be used for DisplayPort, HDMI, DVI or VGA
1x VGA (Analog/CRT)
1x LVDS interface (single ch 24-bit, dual ch 48-bit)

AUDIO

HD Audio (Cirrus Logic CS4207 codec)
1x stereo input
1x stereo output

NETWORK

Port 0, Intel I226IT, 2.5Gb Ethernet
Port 1, Intel 82574I, 1Gb Ethernet

EXPANSION

Mini PCIe Expansion: 2x full-length cards (Both sockets have PCIe, USB, and SATA signaling for mSATA operation)
1x SIM Card Expansion option

I/O

8-bit GPIO
4x USB 3.0
4x USB 2.0 (2 used for Mini PCIe)
1x Console RS-232 (TX/RX)
2x RS-232 (w/ full modem signals)
2x RS-422/485
SMBus
I2C

POWER

Input: Single +12V input +/- 5% (5mm pitch terminal connector)
Power Supply: > 120W power budget recommended

THERMAL OPTIONS

SBC-477-TS570-R-2: With Heatsink
SBC-477-TS570-R-3: With Heatsink and Fan

MECHANICAL

Dimensions:

– SBC-477-TS570-R-2 with Heatsink: 125mm x 95mm x 53mm

– SBC-477-TS570-R-3 with Heatsink and Fan: 125mm x 97mm x 53mm

Weight: 590g / 20.81oz

ENVIRONMENTAL

Industrial Temperature: -40°C to +70°C (-40ºF to +185°F) with model -3 thermal solution1

Humidity: 5% to 95% non-condensing

CE Compliant

RoHS Compliant

1 The COM and carrier are capable to +85°C with an adequate thermal solution.

ORDER INFORMATION

SBC-477-TS570-R-2: With Heatsink
SBC-477-TS570-R-3: With Heatsink and Fan

Accessories

Cable Set: CBL-SET-477-CNT-1