SYS-427 Industrial E3900 Embedded Computer with Dual Ethernet, Multi-Display and Expansion

Description

WINSYSTEMS’ SYS-427 is a rugged, embedded computer featuring the latest generation Intel Apollo Lake-I SOC processor. Its small size, low power, and extended operational temperature make it a great fit for rugged embedded systems in the industrial control, transportation, energy, and industrial IoT markets.

Features

ROHS Compliant
Quality Certified
Lifetime Support
Extended Temperature
Made In USA Badge
Features
  • SYS-4273EMM-RT-P-I
  • SYS-4274EMM-RT-P-I
  • SYS-4275EMM-RT-P-I
Processor
  • Intel Atom x5-E3930 Processor
  • Intel Atom x5-E3940 Processor
  • Intel Atom x7-E3950 Processor
Operating System Compatibility
  • Linux, Windows, and other x86 compatible
  • Linux, Windows, and other x86 compatible
  • Linux, Windows, and other x86 compatible
Memory (RAM)
  • SODIMM DDR3L ECC (up to 8GB)
  • SODIMM DDR3L ECC (up to 8GB)
  • SODIMM DDR3L ECC (up to 8GB)
BIOS
  • AMI – UEFI
  • AMI – UEFI
  • AMI – UEFI
Display
  • Three independent display outputs:
    LVDS with digital backlight and touch control
    2x DisplayPort Ultra 4K Resolution
    (Front Panel I/O)
  • Three independent display outputs:
    LVDS with digital backlight and touch control
    2x DisplayPort Ultra 4K Resolution
    (Front Panel I/O)
  • Three independent display outputs:
    LVDS with digital backlight and touch control
    2x DisplayPort Ultra 4K Resolution
    (Front Panel I/O)
Ethernet
  • 2x Gigabit Ethernet ports (Front Panel I/O)
  • 2x Gigabit Ethernet ports (Front Panel I/O)
  • 2x Gigabit Ethernet ports (Front Panel I/O)
Storage
  • 1x eMMC (16/32/64G)
    1x SATA Connector
    1x mSATA
  • 1x eMMC (16/32/64G)
    1x SATA Connector
    1x mSATA
  • 1x eMMC (16/32/64G)
    1x SATA Connector
    1x mSATA
Data Acquistion
  • 8 lines of general purpose I/O
    2 channels ADC (16 bit resolution)
  • 8 lines of general purpose I/O
    2 channels ADC (16 bit resolution)
  • 8 lines of general purpose I/O
    2 channels ADC (16 bit resolution)
Serial I/O
  • 1x Legacy RS232 Interface (8-wire)
    2x Multi-Protocol Serial Ports (4-wire)
  • 1x Legacy RS232 Interface (8-wire)
    2x Multi-Protocol Serial Ports (4-wire)
  • 1x Legacy RS232 Interface (8-wire)
    2x Multi-Protocol Serial Ports (4-wire)
Expansion
  • Mini PCI Express Socket
    M.2 Socket (E-Key)
    WinSystems Modular IO80 Interface
  • Mini PCI Express Socket
    M.2 Socket (E-Key)
    WinSystems Modular IO80 Interface
  • Mini PCI Express Socket
    M.2 Socket (E-Key)
    WinSystems Modular IO80 Interface
USB
  • 2x USB 3.0 ports (Front Panel I/O)
    2x USB 2.0 ports (Front Panel I/O)
    2x USB 2.0 ports
  • 2x USB 3.0 ports (Front Panel I/O)
    2x USB 2.0 ports (Front Panel I/O)
    2x USB 2.0 ports
  • 2x USB 3.0 ports (Front Panel I/O)
    2x USB 2.0 ports (Front Panel I/O)
    2x USB 2.0 ports
Watchdog Timer
  • Real-time Clock (RTC) w/ opt. battery backup
    Watchdog timer (Adj. 1 sec to 255 min)
  • Real-time Clock (RTC) w/ opt. battery backup
    Watchdog timer (Adj. 1 sec to 255 min)
  • Real-time Clock (RTC) w/ opt. battery backup
    Watchdog timer (Adj. 1 sec to 255 min)
Audio
  • HD Audio Interface (Line Out, Line In, Mic In)
    Speaker output for beep tones
  • HD Audio Interface (Line Out, Line In, Mic In)
    Speaker output for beep tones
  • HD Audio Interface (Line Out, Line In, Mic In)
    Speaker output for beep tones
Power
  • Wide Imput: +10-50V DC
  • Wide Imput: +10-50V DC
  • Wide Imput: +10-50V DC
Mechanical
  • Dimensions – 6.5 in x 4.5 in x 1.38 in
    (165mm x 115mm x 35mm)
    Weight – 2.0 lb (.92 kg)
    PC Board thickness 0.078 inches
  • Dimensions – 6.5 in x 4.5 in x 1.38 in
    (165mm x 115mm x 35mm)
    Weight – 2.0 lb (.92 kg)
    PC Board thickness 0.078 inches
  • Dimensions – 6.5 in x 4.5 in x 1.38 in
    (165mm x 115mm x 35mm)
    Weight – 2.0 lb (.92 kg)
    PC Board thickness 0.078 inches
Operating Temperature Range
  • -40°C to +85°C (-40 to +185°F)
    Requires high temperature grade DRAM
  • -40°C to +85°C (-40 to +185°F)
    Requires high temperature grade DRAM
  • -40°C to +85°C (-40 to +185°F)
    Requires high temperature grade DRAM
Security
  • Soldered down TPM 2.0 hardware security
  • Soldered down TPM 2.0 hardware security
  • Soldered down TPM 2.0 hardware security
Compliance
  • Shock – IEC 60068-2-27
    Vibration – IEC 60068-2-64
    FCC Class A
  • Shock – IEC 60068-2-27
    Vibration – IEC 60068-2-64
    FCC Class A
  • Shock – IEC 60068-2-27
    Vibration – IEC 60068-2-64
    FCC Class A