WINSYSTEMS Debuts Tiny Industrial i.MX 8M SBC With Exceptional Functionality and Performance Plus Integrated Qt Embedded BSP

February 25, 2020

ITX-P-C444 embedded solution leverages versatile NXP i.MX 8M processor, 4G RAM and plentiful I/O options; supports video processing at the edge in harsh environments GRAND PRAIRIE, Texas – February 25, 2020 – Industrial embedded computing trailblazer WINSYSTEMS today announced its newest innovations in potent Pico-ITX single board computers. Based on the NXP i.MX 8M application… Read More »

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WINSYSTEMS to Exhibit at Embedded World 2020

February 20, 2020

WINSYSTEMS will exhibit at Embedded World 2020 from February 25-27 in Nuremberg, Germany. Several new products will be on display, adding to an already impressive lineup of rugged, highly reliable embedded single board computers, industrial computers, panel PCs, I/O expansion cards, and network switches. WINSYSTEMS will introduce its all-new ITX-P-C444, a potent Pico-ITX single board… Read More »

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WINSYSTEMS Unveils Fanless IP65-Rated Panel PC for Rugged Operating Environments That Sustains Full Intel E3900 Performance at -30 to +85C

February 20, 2020
WINSYSTEMS Industrial 12-inch Panel PC

Truly industrial, highly reliable PPC12-427 panel PC solution withstands shock, vibration, dust and low-pressure wash downs; provides abundant connectivity and added security in a low-profile design GRAND PRAIRIE, Texas – February 20, 2020 – Embedded computing pioneer WINSYSTEMS today introduced its multitouch, feature-packed PPC12-427 rugged display platform with an IP65-rated sealed front bezel and gasket… Read More »

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Pick the SBC Form Factor that Fits Your Application Needs

February 6, 2020

Pretty much for its entire existence, the trend in the embedded computing industry has been toward achieving smaller size, lower power, and higher performance. Sometimes these attributes can help each other to drive adoption of new technological advancements, but in others, choices must be made for priorities of size versus power and performance. For example,… Read More »

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WINSYSTEMS Debuts Low-Profile Encased Industrial Computer Platform With Full 4K Display Support and Processing Performance at -40C to +85C

February 6, 2020
Industrial Embedded Computer with Intel® Atom™ E3900 Processor

Feature-packed SYS-427’s compact embedded SBC design harnesses the Intel E3900 processor; stands up to punishing thermal, shock and vibration demands with ruggedized packaging   GRAND PRAIRIE, Texas – February 7, 2020 – Industrial embedded computing innovator WINSYSTEMS today announced its latest enclosed single board computer for extreme operating temperatures and environments. The SYS-427 is a… Read More »

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Form, Fit, and Functional Replacements: More Than Just Component Upgrades

January 31, 2020

Designing long-lifecycle systems goes hand-in-hand with long-term decision making when it comes to your embedded platforms. If chosen carefully, these decisions can help you avoid a myriad of minor inconveniences and potential system-scrapping problems years or even decades down the road, depending on the application. For example, issues like equipment wear and tear and outright… Read More »

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Know When to Compute at the Edge, the Fog, or the Cloud

January 29, 2020

In the Industrial IoT (IIoT), the Cloud acts as the upper-level data storage and analytics engine that can be accessed directly or indirectly by the IIoT’s Edge nodes. While this may seem like a straightforward process, it can be rather complex. The Edge is where the sensors lie and where real-time processing and decisions occur. … Read More »

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The Edge is Getting Cloudy with AI

December 17, 2019
WINSYSTEMS Embedded Solutions Keep Your Industrial AI Data Flowing

When computing is performed at the edge, data is collected at the source from sensors and then some amount of lower-level processing takes place. Processing data at the edge enables real-time decision making by eliminating the need to send sensor data to the cloud for processing, then waiting for the results. Artificial intelligence (AI) will,… Read More »

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